Zeitlarn
Germany
24
2010-04-01
The entities that hold a legal rights for patent applications filed by inventor PAULUS Stefan:
Stefan PAULUS from Zeitlarn, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device
#2 | 2008-11-18Digital camera with a transparent core disposed between a lens and a light-sensitive sensor
#3 | 2008-10-23Process for producing and apparatus for improving the bonding between a plastic and a metal
#4 | 2008-07-03Connector module and method of manufacturing the same
#5 | 2008-06-26MID module and a method of mounting an optical fibre in an MID module
#6 | 2008-05-15Electronic or optoelectronic assembly with an electromagnetic screening structure, method for manufacturing same
#7 | 2007-09-20Optocoupler for converting optical signals into electrical signals and vice versa
#8 | 2007-06-28Semiconductor device with semiconductor device components embedded in a plastic housing composition
#9 | 2007-06-07Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
#10 | 2006-08-31Method for producing a plurality of electronic devices
#11 | 2006-06-27Electronic device with external contact elements and method for producing a plurality of the devices
#12 | 2006-06-06Electronic sensor device and method for producing the electronic sensor device
#13 | 2006-05-04Electronic component comprising external surface contacts and a method for producing the same
#14 | 2006-03-23Production methods for a leadframe and electronic devices
#15 | 2006-03-09Method for producing an optical or electronic module provided with a plastic package and an optical or electronic module
#16 | 2006-02-09Optical or electronic module and method for its production
#17 | 2006-02-02Method for producing an optical or electronic module provided with a plastic package
#18 | 2006-01-19Method for fabricating a semiconductor component with contacts situated at the underside
#19 | 2006-01-19Electronic device with semiconductor chip including a radiofrequency power module
#20 | 2006-01-19Radiofrequency power semiconductor module with cavity housing, and method for producing it
#21 | 2006-01-05Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production
#22 | 2005-11-29Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
#23 | 2005-07-14Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
#24 | 2005-05-24Apparatus for populating transport tapes
3772083 ⎘