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Inventor profile of:

Jun-young Ko

City:

Cheonan-si

Country:

South Korea

Published Applications:

Last publication date:

2024-12-19

Top Assignees for applications by Jun-young Ko

The entities that hold a legal rights for patent applications filed by inventor Ko Jun-young:

SAMSUNG ELECTRONICS CO., LTD. 10 Suwon-si, South Korea
SAMSUNG DISPLAY CO., LTD. 5 Yongin-si, South Korea
Samsung Electronics Co., Ltd 4 , South Korea
SAMSUNG ELECTRONICS CO., LTD. 3 Gyeonggi-Do, South Korea
Samsung Electronics Co., Ltd. 2 Yeongtong-Gu, Suwon-si, Gyeonggi-Do, South Korea
Samsung Electronics Co., Ltd. 1 Gyeonngi-do, South Korea
SAMSUNG DISPLAY CO., LTD. 1 Gyeonggi-do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Suwon, South Korea

Recent patent applications by Ko Jun-young

Jun-young Ko from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-19

US20240419216A1

Physics

FLEXIBLE DISPLAY DEVICE INCLUDING TOUCH SENSOR

#2 | 2023-05-11

US20230146494A1

Physics

Flexible display device including touch sensor

#3 | 2022-10-13

US20220326736A1

Physics

Flexible display device including touch sensor

#4 | 2020-07-02

US20200209927A1

Physics

Flexible display device including touch sensor

#5 | 2017-11-02

US20170315590A1

Physics

Flexible display device including touch sensor

#6 | 2016-01-07

US20160007459A1

Electricity

Printed circuit board and semiconductor package using the same

#7 | 2016-01-07

US20160005654A1

Electricity

SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#8 | 2015-06-25

US20150179625A1

Electricity

Method of fabricating semiconductor package

#9 | 2015-06-04

US20150153779A1

Physics

Flexible display device including touch sensor

#10 | 2015-04-30

US20150118798A1

Electricity

Method of molding semiconductor package

#11 | 2014-08-28

US20140242752A1

Electricity

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

#12 | 2014-03-06

US20140062496A1

Physics

Test apparatus for semiconductor package

#13 | 2013-12-19

US20130337616A1

Electricity

Methods of fabricating semiconductor devices and underfill equipment for the same

#14 | 2013-08-29

US20130223001A1

Electricity

PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME

#15 | 2013-08-08

US20130203220A1

Electricity

Method of molding semiconductor package

#16 | 2012-03-01

US20120049365A1

Electricity

Semiconductor package

#17 | 2011-12-29

US20110318887A1

Electricity

Method of molding semiconductor package

#18 | 2011-05-12

US20110110062A1

Electricity

Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same

#19 | 2009-11-12

US20090278249A1

Electricity

Printed circuit board and method thereof and a solder ball land and method thereof

#20 | 2008-12-25

US20080315408A1

Electricity

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

#21 | 2008-12-18

US20080311727A1

Electricity

Method of cutting a wafer

#22 | 2007-08-23

US20070193920A1

Electricity

Apparatus and method for separating a semiconductor chip

#23 | 2007-05-03

US20070099550A1

Performing operations; transporting

Wafer grinding and tape attaching apparatus and method

#24 | 2007-03-15

US20070057410A1

Electricity

Method of fabricating wafer chips

#25 | 2007-02-22

US20070040282A1

Electricity

Printed circuit board and method thereof and a solder ball land and method thereof

#26 | 2007-02-01

US20070023487A1

Performing operations; transporting

Wire bonding method and device of performing the same

InventorID:

377663 ⎘