HSINCHU
Taiwan
37
2013-06-27
The entities that hold a legal rights for patent applications filed by inventor WANG BILY:
BILY WANG from HSINCHU, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Light-guiding cover structure
#2 | 2013-01-17Light-emitting element detection and classification device
#3 | 2012-04-26Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
#4 | 2012-03-22Lamp head assembly and lighting lamp tube
#5 | 2012-01-19Simple detachable illumination structure and lamp tube
#6 | 2012-01-05LED chip package structure using sedimentation and method for making the same
#7 | 2011-09-22Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
#8 | 2011-06-30Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
#9 | 2011-01-27LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
#10 | 2011-01-27Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
#11 | 2011-01-06LED chip package structure with an embedded ESD function and method for manufacturing the same
#12 | 2010-11-18Detection system for detecting appearances of many electronic elements and methods of using the same
#13 | 2010-10-21Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency
#14 | 2010-08-26GPS device with a display function and method for using the same
#15 | 2010-07-15Wafer level vertical diode package structure and method for making the same
#16 | 2010-04-22LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
#17 | 2010-04-01Illumination device with a fire-fighting function
#18 | 2010-02-11Wafer level LED package structure and method for making the same
#19 | 2009-12-24LED chip package structure with an embedded ESD function and method for manufacturing the same
#20 | 2009-10-22LED chip package structure using a substrate as a lampshade and method for making the same
#21 | 2009-10-08Testing system and testing method for inspecting electonic devices
#22 | 2009-09-10LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same
#23 | 2009-08-27Method for calculating out an optimum arrangement pitch between each two LED chip package units
#24 | 2009-08-27LED chip package structure with multifunctional integrated chips and a method for making the same
#25 | 2009-08-20LED chip package structure with different LED spacings and a method for making the same
#26 | 2009-07-23Method for manufacturing an LED chip package structure
#27 | 2009-06-18LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
#28 | 2009-06-11LED chip package structure with high-efficiency light-emitting effect and method for making the same
#29 | 2009-05-14Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
#30 | 2009-03-12LED chip package structure with high-efficiency light-emitting effect and method of packing the same
#31 | 2009-02-26Front and rear covering type LED package structure and method for packaging the same
#32 | 2009-01-22LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
#33 | 2009-01-08LED lamp structure and system with high-efficiency heat-dissipating function
#34 | 2009-01-08Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
#35 | 2008-07-31LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
#36 | 2008-07-24LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
#37 | 2008-07-03Mold structure for packaging LED chips and method thereof
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