Kunihito Ide

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2010-09-02

Top Assignees for applications by Kunihito Ide

The entities that hold a legal rights for patent applications filed by inventor Ide Kunihito:

Ebara Corporation 4 Tokyo, Japan
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by Ide Kunihito

Kunihito Ide from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-09-02

US20100219078A1

Chemistry; metallurgy

PLATING APPARATUS AND PLATING METHOD

#2 | 2009-02-19

US20090045067A1

Chemistry; metallurgy

Apparatus and method for processing a substrate

#3 | 2008-05-20

US10767253

Electrolytic processing apparatus and substrate processing method

#4 | 2008-02-07

US20080029398A1

Chemistry; metallurgy

Electroplating apparatus and electroplating method

#5 | 2006-04-27

US20060086616A1

Chemistry; metallurgy

Plating apparatus and plating method

#6 | 2005-07-28

US20050164498A1

Chemistry; metallurgy

Plating method and plating apparatus

#7 | 2005-07-07

US20050145482A1

Electricity

Apparatus and method for processing substrate

#8 | 2005-03-10

US20050051434A1

Chemistry; metallurgy

Method and apparatus for controlling electrolytic solution

#9 | 2005-01-06

US20050000820A1

Chemistry; metallurgy

Apparatus and method for processing a substrate

InventorID:

3830357 ⎘