Inventor profile of:

Stephan Dobritz

City:

Dresden

Country:

Germany

Published Applications:

15

Last publication date:

2022-06-09

Top Assignees for applications by Stephan Dobritz

The entities that hold a legal rights for patent applications filed by inventor Dobritz Stephan:

Recent patent applications by Dobritz Stephan

Stephan Dobritz from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-09
US20220181247A1
Electricity

Chip Module, Use of Chip Module, Test Arrangement and Test Method

#2 | 2021-12-30
US20210408302A1
Electricity

Arrangement for an optoelectronic component, manufacturing process and optoelectronic component

#3 | 2009-11-19
US20090283899A1
Electricity

Semiconductor device

#4 | 2009-08-06
US20090194881A1
Electricity

Method for manufacturing a wafer level package

#5 | 2009-03-19
US20090072398A1
Electricity

Integrated circuit, circuit system, and method of manufacturing

#6 | 2009-03-19
US20090072374A1
Electricity

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

#7 | 2009-01-01
US20090001366A1
Electricity

Wafer Arrangement and Method for Manufacturing a Wafer Arrangement

#8 | 2008-04-03
US20080079149A1
Electricity

Circuit board arrangement and method for producing a circuit board arrangement

#9 | 2007-12-06
US20070279877A1
Electricity

Circuit board arrangement

#10 | 2007-10-04
US20070230115A1
Electricity

Memory module

#11 | 2007-05-31
US20070123066A1
Electricity

Interconnection element for BGA housings and method for producing the same

#12 | 2006-09-21
US20060208357A1
Electricity

Integrated device and electronic system

#13 | 2005-09-20
US10306184
-

Leadframe of a conductive material and component with a leadframe of a conductive material

#14 | 2005-05-05
US20050093148A1
Electricity

Interconnection element for BGA housings and method for producing the same

#15 | 2005-04-21
US20050085105A1
Electricity

Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection

InventorID:

3842949 ⎘