Ja Eun Yun

City:

Busan

Country:

South Korea

Published Applications:

Last publication date:

2009-06-18

Top Assignees for applications by Ja Eun Yun

The entities that hold a legal rights for patent applications filed by inventor Yun Ja Eun:

Ja Eun Yun from Busan, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit package system with package integration

Integrated circuit package system with overhang die

Integrated circuit package system with thermo-mechanical interlocking substrates

InventorID:

3843091 ⎘