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Inventor profile of:

Andreas Knorr

City:

Austin, Texas

Country:

United States

Published Applications:

Last publication date:

2009-01-01

Top Assignees for applications by Andreas Knorr

The entities that hold a legal rights for patent applications filed by inventor Knorr Andreas:

INTERNATIONAL BUSINESS MACHINES CORPORATION 8 ARMONK, NY United States
Infineon Technologies AG 5 Munich, Germany
Infineon Technologies North America Corp. 2 San Jose, CA United States
Applied Materials, Inc. 1 Santa Clara, CA United States
INFINEON TECHNOLOGIES NORTH AMERICA CORPORATION 1 San Jose, CA United States
Infineon Technologies, North American Corp. 1 San Jose, CA United States
INTERNATIONAL BUSINESS MACHINES CORP. 1 Armonk, NY United States

Recent patent applications by Knorr Andreas

Andreas Knorr from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-01-01

US20090004865A1

Electricity

METHOD FOR TREATING A WAFER EDGE

#2 | 2007-10-25

US20070245957A1

Electricity

HIGH DENSITY PLASMA OXIDATION

#3 | 2007-09-25

US10338254

High density plasma oxidation

#4 | 2007-07-19

US20070166997A1

Electricity

Semiconductor devices and methods of manufacture thereof

#5 | 2006-11-16

US20060258177A1

Electricity

Method for treating a wafer edge

#6 | 2006-08-15

US10314865

TEOS assisted oxide CMP process

#7 | 2006-04-20

US20060081830A1

Electricity

Air gaps between conductive lines for reduced RC delay of integrated circuits

#8 | 2005-09-20

US10688612

Self-aligned buried strap process using doped HDP oxide

#9 | 2005-06-16

US20050127515A1

Electricity

Sidewall sealing of porous dielectric materials

#10 | 2005-05-10

US10397761

Trench isolation employing a doped oxide trench fill

#11 | 2005-05-05

US20050095872A1

Electricity

HDP process for high aspect ratio gap filling

#12 | 2005-04-14

US20050079730A1

Electricity

Trench isolation employing a high aspect ratio trench

InventorID:

3845840 ⎘