Peter Ossimitz

City:

Muenchen

Country:

Germany

Published Applications:

Last publication date:

2015-06-04

Top Assignees for applications by Peter Ossimitz

The entities that hold a legal rights for patent applications filed by inventor Ossimitz Peter:

Peter Ossimitz from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated IC package

Chip arrangement, and method for forming a chip arrangement

Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

Method of manufacturing and testing a chip package

Chip package having terminal pads of different form factors

Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

Semiconductor memory component having a diverting circuit

Rewiring substrate strip having a plurality of semiconductor component positions

InventorID:

384936 ⎘