Phoenix, Arizona
United States
14
2020-04-16
The entities that hold a legal rights for patent applications filed by inventor Modi Mitul B.:
Mitul B. Modi from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Conductive coating for a microelectronics package
#2 | 2019-05-23Systems and methods for electromagnetic interference shielding
#3 | 2018-06-21Conductive coating for a microelectronics package
#4 | 2018-06-14Semiconductor package with electromagnetic interference shielding structures
#5 | 2017-10-05INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD
#6 | 2017-10-05Systems and methods for electromagnetic interference shielding
#7 | 2017-08-31PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR DEVICE AND COMPONENTS
#8 | 2017-06-22Perforated conductive material for EMI shielding of semiconductor device and components
#9 | 2013-08-15Underfill device and method
#10 | 2008-03-06Flexible core for enhancement of package interconnect reliablity
#11 | 2008-03-06Flexible core for enhancement of package interconnect reliability
#12 | 2007-02-01No flow underfill device and method
#13 | 2007-01-04Underfill device and method
#14 | 2006-11-23Flexible core for enhancement of package interconnect reliability
386876 ⎘