Omar Bchir

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2009-10-01

Top Assignees for applications by Omar Bchir

The entities that hold a legal rights for patent applications filed by inventor Bchir Omar:

Omar Bchir from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Optical die structures and associated package substrates

Method of forming solder bumps on substrates

Method of enabling selective area plating on a substrate

PRINTED CIRCUIT BOARD AND METHOD FOR PREPARATION THEREOF

InventorID:

3891958 ⎘