Tee-Eu Jin

City:

Country:

United States

Published Applications:

Last publication date:

2009-03-05

Top Assignees for applications by Tee-Eu Jin

The entities that hold a legal rights for patent applications filed by inventor Jin Tee-Eu:

Tee-Eu Jin from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

InventorID:

3892655 ⎘