Fishkill, New York
United States
5
2009-03-19
The entities that hold a legal rights for patent applications filed by inventor Kim Jae Hak:
Jae Hak Kim from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS FOR FORMING DUAL DAMASCENE WIRING USING POROGEN CONTAINING SACRIFICIAL VIA FILLER MATERIAL
#2 | 2008-03-13Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layers
#3 | 2007-05-10Methods of forming contact structures in low-k materials using dual damascene processes
#4 | 2006-08-10Methods for forming dual damascene wiring for semiconductor devices using protective via capping layer
#5 | 2006-06-08Methods for forming dual damascene wiring using porogen containing sacrificial via filler material
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