Dasing
Germany
21
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Furgut Edward:
Edward Furgut from Dasing, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
#2 | 2026-01-29SEMICONDUCTOR ARRANGEMENT, SYSTEM AND MANUFACTURING METHOD
#3 | 2025-11-20Power Semiconductor Device Stack, Power Module, and Method of Producing a Power Semiconductor Device Stack
#4 | 2025-11-20SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT WITH A PERIPHERAL SIDE WALL HAVING A RECESS AND A LEAD DISPOSED IN THE RECESS
#5 | 2025-10-16APPLICATION BOARD AND A SEMICONDUCTOR PACKAGE MOUNTED THEREON FOR REDUCING CREEPAGE CURRENTS
#6 | 2025-06-19SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNECTION
#7 | 2025-01-09Power Package With Galvanic Isolation
#8 | 2024-08-08A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME
#9 | 2024-07-18SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERTICAL CONNECTORS
#10 | 2024-04-04GATE DRIVER CIRCUIT AND POWER SWITCHING ASSEMBLY WITH GATE DRIVER CIRCUIT
#11 | 2024-04-04Silicon Carbide Device and Method for Forming a Silicon Carbide Device
#12 | 2024-01-11Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
#13 | 2023-11-23ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESION PROMOTER LAYER
#14 | 2023-11-09SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNECTED BETWEEN PINS OF A SEMICONDUCTOR DIE AND A FURTHER DEVICE
#15 | 2023-11-09METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE
#16 | 2023-09-21SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#17 | 2023-09-07SEMICONDUCTOR DIE PACKAGE
#18 | 2023-09-07SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME
#19 | 2015-05-28Electronic component with electronic chip between redistribution structure and mounting structure
#20 | 2009-03-26Semiconductor device including electronic component coupled to a backside of a chip
#21 | 2008-09-02Electronic component and semiconductor wafer, and method for producing the same
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