Inventor profile of:

Edward Furgut

City:

Dasing

Country:

Germany

Published Applications:

21

Last publication date:

2026-06-18

Top Assignees for applications by Edward Furgut

The entities that hold a legal rights for patent applications filed by inventor Furgut Edward:

Recent patent applications by Furgut Edward

Edward Furgut from Dasing, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-18
US20260173901A1
Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

#2 | 2026-01-29
US20260033350A1
Electricity

SEMICONDUCTOR ARRANGEMENT, SYSTEM AND MANUFACTURING METHOD

#3 | 2025-11-20
US20250357454A1
Electricity

Power Semiconductor Device Stack, Power Module, and Method of Producing a Power Semiconductor Device Stack

#4 | 2025-11-20
US20250357232A1
Electricity

SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT WITH A PERIPHERAL SIDE WALL HAVING A RECESS AND A LEAD DISPOSED IN THE RECESS

#5 | 2025-10-16
US20250323138A1
Electricity

APPLICATION BOARD AND A SEMICONDUCTOR PACKAGE MOUNTED THEREON FOR REDUCING CREEPAGE CURRENTS

#6 | 2025-06-19
US20250201682A1
Electricity

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNECTION

#7 | 2025-01-09
US20250014971A1
Electricity

Power Package With Galvanic Isolation

#8 | 2024-08-08
US20240266237A1
Electricity

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME

#9 | 2024-07-18
US20240243092A1
Electricity

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERTICAL CONNECTORS

#10 | 2024-04-04
US20240113705A1
Electricity

GATE DRIVER CIRCUIT AND POWER SWITCHING ASSEMBLY WITH GATE DRIVER CIRCUIT

#11 | 2024-04-04
US20240113026A1
Electricity

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

#12 | 2024-01-11
US20240014104A1
Electricity

Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor

#13 | 2023-11-23
US20230378011A1
Electricity

ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESION PROMOTER LAYER

#14 | 2023-11-09
US20230361009A1
Electricity

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNECTED BETWEEN PINS OF A SEMICONDUCTOR DIE AND A FURTHER DEVICE

#15 | 2023-11-09
US20230360929A1
Electricity

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE

#16 | 2023-09-21
US20230298956A1
Electricity

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN

#17 | 2023-09-07
US20230282608A1
Electricity

SEMICONDUCTOR DIE PACKAGE

#18 | 2023-09-07
US20230282591A1
Electricity

SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME

#19 | 2015-05-28
US20150145111A1
Electricity

Electronic component with electronic chip between redistribution structure and mounting structure

#20 | 2009-03-26
US20090079065A1
Electricity

Semiconductor device including electronic component coupled to a backside of a chip

#21 | 2008-09-02
US10789033
-

Electronic component and semiconductor wafer, and method for producing the same

InventorID:

3909713 ⎘