Inventor profile of:

David L. Thomas

City:

Endicott, New York

Country:

United States

Published Applications:

13

Last publication date:

2009-04-30

Top Assignees for applications by David L. Thomas

The entities that hold a legal rights for patent applications filed by inventor Thomas David L.:

Recent patent applications by Thomas David L.

David L. Thomas from Endicott, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-04-30
US20090109624A1
Electricity

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

#2 | 2007-10-25
US20070249089A1
Physics

Method of making circuitized substrate with internal organic memory device

#3 | 2007-07-31
US10282975
-

Method of making an electronic package

#4 | 2006-09-28
US20060214010A1
Physics

Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

#5 | 2006-09-14
US20060200977A1
Electricity

Method of making circuitized substrate with signal wire shielding

#6 | 2006-06-22
US20060131755A1
Electricity

Method of making circuitized substrate

#7 | 2006-06-15
US20060125103A1
Electricity

Information handling system including a circuitized substrate having a dielectric layer without continuous fibers

#8 | 2006-02-02
US20060022310A1
Physics

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

#9 | 2006-02-02
US20060022303A1
Physics

Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

#10 | 2005-10-13
US20050224985A1
Electricity

Circuitized substrate

#11 | 2005-09-08
US20050195585A1
Electricity

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

#12 | 2005-05-17
US10217674
-

High performance dense wire for printed circuit board

#13 | 2005-01-13
US20050005439A1
Electricity

Coupling of conductive vias to complex power-signal substructures

InventorID:

3933899 ⎘