Endicott, New York
United States
179
2013-12-17
153
2013-12-17
These are the the leading inventors for applications assigned to ENDICOTT INTERCONNECT TECHNOLOGIES, INC.:
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. based in Endicott, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Substrate having internal capacitor and method of making same
#2 | 2013-11-26 ✅ Patent 8,592,299 granted on 2013-11-26Solder and electrically conductive adhesive based interconnection for CZT crystal attach
#3 | 2013-10-10 ✅ Patent 8,742,522 granted on 2014-06-03Method of making a semiconductor radiation detector
#4 | 2013-08-06 ✅ Patent 8,499,445 granted on 2013-08-06Method of forming an electrically conductive printed line
#5 | 2013-05-21 ✅ Patent 8,446,707 granted on 2013-05-21Circuitized substrate with low loss capacitive material and method of making same
#6 | 2013-02-07 ✅ Patent 9,451,693 granted on 2016-09-20Electrically conductive adhesive (ECA) for multilayer device interconnects
#7 | 2013-02-07LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT
#8 | 2013-01-31THERMAL SUBSTRATE
#9 | 2012-10-11MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
#10 | 2012-10-11CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
#11 | 2012-10-11 ✅ Patent 8,493,173 granted on 2013-07-23Method of cavity forming on a buried resistor layer using a fusion bonding process
#12 | 2012-10-04CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE
#13 | 2012-09-27CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
#14 | 2012-09-27LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION
#15 | 2012-09-13CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME
#16 | 2012-09-13DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS
#17 | 2012-09-06 ✅ Patent 8,501,575 granted on 2013-08-06Method of forming multilayer capacitors in a printed circuit substrate
#18 | 2012-08-09 ✅ Patent 8,558,374 granted on 2013-10-15Electronic package with thermal interposer and method of making same
#19 | 2012-06-28ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
#20 | 2012-06-28 ✅ Patent 8,541,687 granted on 2013-09-24Coreless layer buildup structure
#21 | 2012-06-28 ✅ Patent 8,536,459 granted on 2013-09-17Coreless layer buildup structure with LGA
#22 | 2012-06-21 ✅ Patent 8,299,371 granted on 2012-10-30Circuitized substrate with dielectric interposer assembly and method
#23 | 2012-05-10HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
#24 | 2012-03-22 ✅ Patent 8,685,284 granted on 2014-04-01Conducting paste for device level interconnects
#25 | 2012-03-22 ✅ Patent 8,143,530 granted on 2012-03-27Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
#26 | 2012-03-22 ✅ Patent 8,288,857 granted on 2012-10-16Anti-tamper microchip package based on thermal nanofluids or fluids
#27 | 2012-02-16 ✅ Patent 8,198,739 granted on 2012-06-12Semi-conductor chip with compressible contact structure and electronic package utilizing same
#28 | 2012-02-09 ✅ Patent 9,351,408 granted on 2016-05-24Coreless layer buildup structure with LGA and joining layer
#29 | 2012-01-26 ✅ Patent 9,756,724 granted on 2017-09-05Method of making a circuitized substrate
#30 | 2012-01-19 ✅ Patent 8,240,031 granted on 2012-08-14Method of joining a semiconductor device/chip to a printed wiring board
#31 | 2012-01-19METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
#32 | 2011-11-24 ✅ Patent 8,198,551 granted on 2012-06-12Power core for use in circuitized substrate and method of making same
#33 | 2011-10-27METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS
#34 | 2011-08-18 ✅ Patent 8,196,281 granted on 2012-06-12Method of applying force to electrical contacts on a printed circuit board
#35 | 2011-07-21 ✅ Patent 7,977,034 granted on 2011-07-12Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
#36 | 2011-06-02 ✅ Patent 8,405,229 granted on 2013-03-26Electronic package including high density interposer and circuitized substrate assembly utilizing same
#37 | 2011-06-02 ✅ Patent 8,245,392 granted on 2012-08-21Method of making high density interposer and electronic package utilizing same
#38 | 2011-02-24 ✅ Patent 8,247,703 granted on 2012-08-21Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
#39 | 2010-12-30 ✅ Patent 8,242,376 granted on 2012-08-14Circuitized substrates utilizing smooth-sided conductive layers as part thereof
#40 | 2010-12-23 ✅ Patent 7,972,178 granted on 2011-07-05High density connector for interconnecting fine pitch circuit packaging structures
#41 | 2010-07-01 ✅ Patent 8,144,480 granted on 2012-03-27Multi-layer embedded capacitance and resistance substrate core
#42 | 2010-03-11 ✅ Patent 7,791,897 granted on 2010-09-07Multi-layer embedded capacitance and resistance substrate core
#43 | 2009-12-31 ✅ Patent 8,028,390 granted on 2011-10-04Spring actuated clamping mechanism
#44 | 2009-12-10 ✅ Patent 8,354,650 granted on 2013-01-15Multi-window signal processing electronics architecture for photon counting with multi-element sensors
#45 | 2009-09-24 ✅ Patent 7,705,320 granted on 2010-04-27Radiation detector with co-planar grid structure
#46 | 2009-08-20 ✅ Patent 7,803,688 granted on 2010-09-28Capacitive substrate and method of making same
#47 | 2009-07-16Method of making circuitized assembly including a plurality of circuitized substrates
#48 | 2009-07-16 ✅ Patent 8,240,027 granted on 2012-08-14Method of making circuitized substrates having film resistors as part thereof
#49 | 2009-07-09 ✅ Patent 8,499,440 granted on 2013-08-06Method of making halogen-free circuitized substrate with reduced thermal expansion
#50 | 2009-07-09 ✅ Patent 8,211,790 granted on 2012-07-03Multilayered circuitized substrate with P-aramid dielectric layers and method of making same
#51 | 2009-04-30 ✅ Patent 7,738,249 granted on 2010-06-15Circuitized substrate with internal cooling structure and electrical assembly utilizing same
#52 | 2009-04-09 ✅ Patent 7,713,767 granted on 2010-05-11Method of making circuitized substrate with internal optical pathway using photolithography
#53 | 2009-04-09 ✅ Patent 7,541,058 granted on 2009-06-02Method of making circuitized substrate with internal optical pathway
#54 | 2009-03-12 ✅ Patent 7,705,319 granted on 2010-04-27CdZnTe device using constrained design for high-flux x-ray spectroscopic imaging applications
#55 | 2009-02-12 ✅ Patent 7,612,345 granted on 2009-11-03Radiation detector crystal and method of formation thereof
#56 | 2009-02-05Adhesive bleed prevention method and product produced from same
#57 | 2009-01-15 ✅ Patent 7,633,068 granted on 2009-12-15Count uniformity correction in flux space for pixilated semiconducting radiation detectors
#58 | 2008-12-11 ✅ Patent 7,712,210 granted on 2010-05-11Method of providing a printed circuit board with an edge connection portion
#59 | 2008-10-30 ✅ Patent 7,738,631 granted on 2010-06-15Energy discriminating scatter imaging system
#60 | 2008-10-23 ✅ Patent 7,838,776 granted on 2010-11-23Circuitized substrates utilizing smooth-sided conductive layers as part thereof
#61 | 2008-10-09Method of making a circuitized substrate having at least one capacitor therein
#62 | 2008-10-09 ✅ Patent 7,800,916 granted on 2010-09-21Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
#63 | 2008-10-02 ✅ Patent 7,910,156 granted on 2011-03-22Method of making circuitized substrate with selected conductors having solder thereon
#64 | 2008-10-02 ✅ Patent 7,841,741 granted on 2010-11-30LED lighting assembly and lamp utilizing same
#65 | 2008-10-02 ✅ Patent 7,851,906 granted on 2010-12-14Flexible circuit electronic package with standoffs
#66 | 2008-08-14 ✅ Patent 8,084,863 granted on 2011-12-27Circuitized substrate with continuous thermoplastic support film dielectric layers
#67 | 2008-08-14 ✅ Patent 7,646,098 granted on 2010-01-12Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
#68 | 2008-07-17 ✅ Patent 7,510,324 granted on 2009-03-31Method of inspecting articles using imaging inspection apparatus with directional cooling
#69 | 2008-07-17 ✅ Patent 7,596,863 granted on 2009-10-06Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
#70 | 2008-07-10Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
#71 | 2008-06-26 ✅ Patent 7,870,664 granted on 2011-01-18Method of making circuitized substrate with a resistor
#72 | 2008-06-19 ✅ Patent 7,490,984 granted on 2009-02-17Method of making an imaging inspection apparatus with improved cooling
#73 | 2008-06-19 ✅ Patent 7,875,811 granted on 2011-01-25High speed interposer
#74 | 2008-06-12 ✅ Patent 7,638,776 granted on 2009-12-29Staggered array imaging system using pixilated radiation detectors
#75 | 2008-05-29Method of making high speed interposer
#76 | 2008-05-22 ✅ Patent 7,491,896 granted on 2009-02-17Information handling system utilizing circuitized substrate with split conductive layer
#77 | 2008-05-15 ✅ Patent 7,547,577 granted on 2009-06-16Method of making circuitized substrate with solder paste connections
#78 | 2008-05-08Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof
#79 | 2008-05-01 ✅ Patent 7,622,384 granted on 2009-11-24Method of making multi-chip electronic package with reduced line skew
#80 | 2008-05-01 ✅ Patent 7,595,454 granted on 2009-09-29Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
#81 | 2008-04-17 ✅ Patent 7,687,724 granted on 2010-03-30Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
#82 | 2008-04-03 ✅ Patent 7,687,722 granted on 2010-03-30Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
#83 | 2008-03-06Circuitized substrate with increased roughness conductive layer as part thereof
#84 | 2008-02-21 ✅ Patent 7,376,218 granted on 2008-05-20X-ray source assembly
#85 | 2008-02-14 ✅ Patent 8,288,266 granted on 2012-10-16Circuitized substrate assembly
#86 | 2008-01-31 ✅ Patent 7,635,552 granted on 2009-12-22Photoresist composition with antibacterial agent
#87 | 2008-01-31 ✅ Patent 7,823,274 granted on 2010-11-02Method of making multilayered circuitized substrate assembly
#88 | 2008-01-24 ✅ Patent 7,511,518 granted on 2009-03-31Method of making an interposer
#89 | 2008-01-03 ✅ Patent 8,445,094 granted on 2013-05-21Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers
#90 | 2007-12-20 ✅ Patent 7,629,541 granted on 2009-12-08High speed interposer
#91 | 2007-12-13 ✅ Patent 7,589,283 granted on 2009-09-15Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
#92 | 2007-11-29 ✅ Patent 7,897,877 granted on 2011-03-01Capacitive substrate
#93 | 2007-11-22 ✅ Patent 7,328,502 granted on 2008-02-12Apparatus for making circuitized substrates in a continuous manner
#94 | 2007-11-01 ✅ Patent 7,510,912 granted on 2009-03-31Method of making wirebond electronic package with enhanced chip pad design
#95 | 2007-10-25 ✅ Patent 7,326,643 granted on 2008-02-05Method of making circuitized substrate with internal organic memory device
#96 | 2007-10-04 ✅ Patent 7,629,684 granted on 2009-12-08Adjustable thickness thermal interposer and electronic package utilizing same
#97 | 2007-09-27 ✅ Patent 8,063,315 granted on 2011-11-22Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
#98 | 2007-08-30 ✅ Patent 7,627,947 granted on 2009-12-08Method for making a multilayered circuitized substrate
#99 | 2007-08-09 ✅ Patent 7,416,972 granted on 2008-08-26Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
#100 | 2007-08-02Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
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