Cheng-Pin Chen

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2009-05-21

Top Assignees for applications by Cheng-Pin Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Cheng-Pin:

Cheng-Pin Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

POP (package-on-package) device encapsulating soldered joints between external leads

Semiconductor package and fabrication process thereof

InventorID:

3948182 ⎘