Benjamin P. Bayer

City:

Aurora, Illinois

Country:

United States

Published Applications:

Last publication date:

2009-06-18

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Benjamin P. Bayer from Aurora, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Chemical-mechanical polishing composition and method for using the same

CMP of noble metals

CMP method for noble metals

CMP composition with a polymer additive for polishing noble metals

Polishing composition for noble metals

Chemical-mechanical polishing composition and method for using the same

Chemical-mechanical polishing of metals in an oxidized form

InventorID:

3967194 ⎘