Erich Ernstberger

City:

Windischeschenbach

Country:

Germany

Published Applications:

Last publication date:

2014-06-19

Top Assignees for applications by Erich Ernstberger

The entities that hold a legal rights for patent applications filed by inventor Ernstberger Erich:

CURAMIK ELECTRONICS GMBH 2 Eschenbach, Germany
Rogers Germany GmbH 2 Eschenbach, Germany

Recent patent applications by Ernstberger Erich

Erich Ernstberger from Windischeschenbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-06-19

US20140166533A1

Electricity

Packaging for substrates and packaging unit having such packaging

#2 | 2013-08-22

US20130213853A1

Performing operations; transporting

Package for metal-ceramic substrate and method for packing such substrates

InventorID:

396834 ⎘