Eschenbach
Germany
23
2014-06-19
22
2015-06-09
These are the the leading inventors for applications assigned to CURAMIK ELECTRONICS GMBH:
CURAMIK ELECTRONICS GMBH based in Eschenbach, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Packaging for substrates and packaging unit having such packaging
#2 | 2013-08-22 ✅ Patent 9,434,509 granted on 2016-09-06Package for metal-ceramic substrate and method for packing such substrates
#3 | 2012-08-02 ✅ Patent 8,342,384 granted on 2013-01-01Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
#4 | 2012-05-31 ✅ Patent 8,749,052 granted on 2014-06-10Electronic device
#5 | 2012-02-23Metal-Ceramic Substrate
#6 | 2012-02-09 ✅ Patent 8,304,054 granted on 2012-11-06Printed circuit board made from a composite material
#7 | 2010-11-18 ✅ Patent 8,559,475 granted on 2013-10-15Heat sink and assembly or module unit
#8 | 2010-10-14 ✅ Patent 8,435,640 granted on 2013-05-07Metal-ceramic substrate
#9 | 2010-09-09 ✅ Patent 8,119,220 granted on 2012-02-21Composite material, especially multilayer material, and adhesive or bonding material
#10 | 2009-11-05 ✅ Patent 8,481,842 granted on 2013-07-09Process for producing Peltier modules, and Peltier module
#11 | 2009-09-17 ✅ Patent 8,683,682 granted on 2014-04-01Method for the production of a metal-ceramic substrate
#12 | 2009-08-27 ✅ Patent 7,940,526 granted on 2011-05-10Electrical module
#13 | 2009-06-04 ✅ Patent 8,519,530 granted on 2013-08-27Method for treating nanofiber material and composition of nanofiber material
#14 | 2009-01-22 ✅ Patent 8,069,561 granted on 2011-12-06Method for manufacturing a metal-ceramic substrate
#15 | 2008-08-14 ✅ Patent 8,130,807 granted on 2012-03-06Diode laser array and method for manufacturing such an array
#16 | 2007-11-15 ✅ Patent 7,811,655 granted on 2010-10-12Metal-ceramic substrate
#17 | 2007-11-15 ✅ Patent 8,377,240 granted on 2013-02-19Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
#18 | 2007-07-12 ✅ Patent 8,056,230 granted on 2011-11-15Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks
#19 | 2007-04-26 ✅ Patent 7,800,908 granted on 2010-09-21Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink
#20 | 2006-06-08 ✅ Patent 7,528,470 granted on 2009-05-05Conductor board and method for producing a conductor board
#21 | 2006-02-21 ✅ Patent 7,000,316 granted on 2006-02-21Conductor board and method for producing a conductor board
#22 | 2006-02-02 ✅ Patent 8,584,924 granted on 2013-11-19Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
#23 | 2005-09-29 ✅ Patent 7,187,545 granted on 2007-03-06Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support
Also check out CURAMIK ELECTRONICS GMBH's (Eschenbach, Germany) applicant profile with 2 patent applications submitted.
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