Ji-cheng Lin

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2010-04-06

Top Assignees for applications by Ji-cheng Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Ji-cheng:

Ji-cheng Lin from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Mold array process for semiconductor packages

Structure for reducing stress for vias and fabricating method thereof

Structure for reducing stress for vias and fabricating method thereof

InventorID:

3969887 ⎘