Garlate
Italy
26
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor Maggi Luca:
Luca Maggi from Garlate, IT has applied for patents for these inventions. The list has both pending applications and granted patents:
SENSOR WITH MOUNTING FLANGE AND ASSOCIATED METHOD
#2 | 2025-10-16PACKAGE FOR MULTIPLE LOUDSPEAKERS
#3 | 2025-04-17INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE
#4 | 2025-04-10PHOTONIC WAFER LEVEL TESTING SYSTEMS, DEVICES, AND METHODS OF OPERATION
#5 | 2025-03-27PRESSURE SENSOR WITH FLANGE
#6 | 2023-06-22PHOTONIC IC CHIP
#7 | 2023-06-01ELECTRONIC MODULE CARRYING A PLURALITY OF ELECTRONIC DEVICES
#8 | 2022-05-19Photonic IC chip
#9 | 2022-03-31Integrated electronic module including two micromirrors, and system including the electronic module
#10 | 2021-12-09Opto-mechanical transducer apparatus and corresponding method
#11 | 2021-09-02Photonic wafer level testing systems, devices, and methods of operation
#12 | 2020-10-01Photonic IC chip
#13 | 2020-01-30Photonic wafer level testing systems, devices, and methods of operation
#14 | 2020-01-09Optical integrated circuit systems, devices, and methods of fabrication
#15 | 2019-12-05Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system
#16 | 2019-04-16Optical integrated circuit systems, devices, and methods of fabrication
#17 | 2018-11-22Optical semiconductor chip, corresponding arrangement, apparatus and method
#18 | 2018-10-18Optoelectronic device having improved optical coupling
#19 | 2018-02-15METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND CIRCUIT
#20 | 2017-03-30System for coupling light to integrated devices and corresponding method
#21 | 2015-04-16Microelectromechanical device with protection for bonding
#22 | 2014-12-04Optoelectronic device having improved optical coupling
#23 | 2014-12-04Wafer-level packaging of integrated devices, and manufacturing method thereof
#24 | 2014-03-06Packaged device exposed to environmental air and liquids and manufacturing method thereof
#25 | 2013-08-22Semiconductor integrated device assembly process
#26 | 2012-06-21Microelectromechanical transducer and corresponding assembly process
397700 ⎘