Heike Salz

Method for selectively removing a spacer in a dual stress liner approach

Interlayer dielectric material in a semiconductor device comprising a doublet structure of stressed materials

Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies

Method for reducing etch-induced process uniformities by omitting deposition of an endpoint detection layer during patterning of stressed overlayers in a semiconductor device

Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device

Method of increasing the etch selectivity in a contact structure of semiconductor devices

Semiconductor device comprising a contact structure with increased etch selectivity

Technique for creating different mechanical strain by a contact etch stop layer stack with an intermediate etch stop layer

Technique for creating different mechanical strain by forming a contact etch stop layer stack having differently modified intrinsic stress