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Inventor profile of:

Bin Wang

City:

Xi'an

Country:

China

Published Applications:

6

Last publication date:

2026-04-02

Top Assignees for applications by Bin Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Bin:

  • SAMSUNG ELECTRONICS CO., LTD. 1 Suwon-si, South Korea
  • HUAWEI TECHNOLOGIES CO., LTD. 1 Shenzhen, China
  • Qimonda AG 1 Muenchen, Germany

Recent patent applications by Wang Bin

Bin Wang from Xi'an, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-02
US20260095197A1
Electricity

MEMORY DEVICE WITH DYNAMIC COMPRESSION TREES

#2 | 2024-02-08
US20240048950A1
Electricity

SERVICE PROCESSING METHOD AND RELATED DEVICE

#3 | 2024-01-04
US20240007851A1
Electricity

DEVICE CONTROL RIGHT OBTAINING METHOD AND COMMUNICATION SYSTEM

#4 | 2023-07-13
US20230223408A1
Electricity

CMOS STRUCTURE, AND FABRICATION METHODS OF FINFET CMOS, FD CMOS AND GAA CMOS

#5 | 2021-01-21
US20210016253A1
Performing operations; transporting

HIGHLY DISPERSED ULTRA-SMALL SIZE CARBON-SUPPORTED NOBLE METAL CATALYST AND PREPARATION METHOD THEREOF

#6 | 2009-09-03
US20090219032A1
Physics

SYSTEM AND METHOD FOR DETERMINING CIRCUIT FUNCTIONALITY UNDER VARYING EXTERNAL OPERATING CONDITIONS

InventorID:

4016370 ⎘

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