BoHan Yoon

City:

Icheon-Si

Country:

South Korea

Published Applications:

Last publication date:

2009-10-01

Top Assignees for applications by BoHan Yoon

The entities that hold a legal rights for patent applications filed by inventor Yoon BoHan:

BoHan Yoon from Icheon-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit package system with support structure under wire-in-film adhesive

Integrated circuit system with a debris trapping system

InventorID:

4033291 ⎘