Eiji Ideta

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2012-03-20

Top Assignees for applications by Eiji Ideta

The entities that hold a legal rights for patent applications filed by inventor Ideta Eiji:

TADAHIRO OHMI 3 MIYAGI-KEN, Japan
FUJIKIN INCORPORATED 3 Osaka, Japan
Tadahiro Ohmi 2 Sendai, Japan
Fujikin Inc. 2 Osaka, Japan
FUJIKIN INCORPORATED 2 Osaka-shi, Japan
Tadahiro OHMI 1 Miyagi, Japan
Tokyo Electron Ltd. 1 Tokyo, Japan

Recent patent applications by Ideta Eiji

Eiji Ideta from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-03-20

US9889269

Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas

#2 | 2008-01-03

US20080003441A1

Chemistry; metallurgy

Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system

#3 | 2006-08-10

US20060174977A1

Chemistry; metallurgy

Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas

#4 | 2005-08-18

US20050179259A1

Mechanical engineering

Pipe joint

#5 | 2005-05-26

US20050109967A1

Mechanical engineering

Valve with an integral orifice

#6 | 2005-03-29

US10048597

Valve with an integral orifice

#7 | 2005-02-01

US10775104

Parallel divided flow-type fluid supply apparatus, and fluid-switchable pressure-type flow control method and fluid-switchable pressure-type flow control system for the same fluid supply apparatus

InventorID:

4087212 ⎘