Tokyo
Japan
36
2021-04-29
34
2023-01-31
These are the the leading inventors for applications assigned to Tokyo Electron Ltd.:
Tokyo Electron Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Fluid supply device and fluid supply method
#2 | 2016-09-22 ✅ Patent 9,921,089 granted on 2018-03-20Flow rate range variable type flow rate control apparatus
#3 | 2016-04-21 ✅ Patent 9,383,758 granted on 2016-07-05Flow rate range variable type flow rate control apparatus
#4 | 2013-12-26 ✅ Patent 9,098,082 granted on 2015-08-04Device and method for supplying gas while dividing to chamber from gas supplying facility equipped with flow controller
#5 | 2013-08-29 ✅ Patent 9,010,369 granted on 2015-04-21Flow rate range variable type flow rate control apparatus
#6 | 2011-04-28 ✅ Patent 8,496,022 granted on 2013-07-30Device and method for supplying gas while dividing to chamber from gas supplying facility equipped with flow controller
#7 | 2010-09-16 ✅ Patent 8,372,200 granted on 2013-02-12Shower plate, method for manufacturing the shower plate, plasma processing apparatus using the shower plate, plasma processing method and electronic device manufacturing method
#8 | 2010-06-24 ✅ Patent 8,082,124 granted on 2011-12-20Method and system for diagnosing abnormal plasma discharge
#9 | 2010-06-10 ✅ Patent 8,418,714 granted on 2013-04-16Flow rate range variable type flow rate control apparatus
#10 | 2008-01-17 ✅ Patent 7,469,192 granted on 2008-12-23Parallel profile determination for an optical metrology system
#11 | 2008-01-17 ✅ Patent 7,515,283 granted on 2009-04-07Parallel profile determination in optical metrology
#12 | 2007-11-08Probe and probe card
#13 | 2007-10-11 ✅ Patent 7,487,053 granted on 2009-02-03Refining a virtual profile library
#14 | 2007-10-11 ✅ Patent 7,542,859 granted on 2009-06-02Creating a virtual profile library
#15 | 2007-10-04 ✅ Patent 7,305,322 granted on 2007-12-04Using a virtual profile library
#16 | 2007-10-04 ✅ Patent 7,576,851 granted on 2009-08-18Creating a library for measuring a damaged structure formed on a wafer using optical metrology
#17 | 2007-10-04 ✅ Patent 7,623,978 granted on 2009-11-24Damage assessment of a wafer using optical metrology
#18 | 2007-10-04 ✅ Patent 7,502,709 granted on 2009-03-10Dynamic metrology sampling for a dual damascene process
#19 | 2007-10-04 ✅ Patent 7,324,193 granted on 2008-01-29Measuring a damaged structure formed on a wafer using optical metrology
#20 | 2007-10-04 ✅ Patent 7,619,731 granted on 2009-11-17Measuring a damaged structure formed on a wafer using optical metrology
#21 | 2007-09-06SUBSTRATE PROCESSING METHOD AND MATERIAL FOR ELECTRONIC DEVICE
#22 | 2007-08-23 ✅ Patent 7,594,517 granted on 2009-09-29Gas supply facility of a chamber and a method for an internal pressure control of the chamber for which the facility is employed
#23 | 2007-02-15 ✅ Patent 7,407,324 granted on 2008-08-05Method and apparatus for monitoring the thickness of a conductive coating
#24 | 2007-02-08 ✅ Patent 7,279,427 granted on 2007-10-09Damage-free ashing process and system for post low-k etch
#25 | 2006-10-12 ✅ Patent 7,501,352 granted on 2009-03-10Method and system for forming an oxynitride layer
#26 | 2006-10-12 ✅ Patent 7,517,814 granted on 2009-04-14Method and system for forming an oxynitride layer by performing oxidation and nitridation concurrently
#27 | 2006-10-12 ✅ Patent 7,265,066 granted on 2007-09-04Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation
#28 | 2006-10-12 ✅ Patent 7,300,891 granted on 2007-11-27Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation
#29 | 2006-08-01 ✅ Patent 7,085,628 granted on 2006-08-01Apparatus for the correction of temperature drift for pressure sensor, pressure control apparatus and pressure-type flow rate control apparatus
#30 | 2006-04-13 ✅ Patent 7,926,509 granted on 2011-04-19Method for flow rate control of clustering fluid and device for flow rate control of clustering fluid employed in the method
#31 | 2005-11-15 ✅ Patent 6,964,279 granted on 2005-11-15Pressure-type flow rate control apparatus
#32 | 2005-06-30 ✅ Patent 7,161,360 granted on 2007-01-09Electrostatic capacitance sensor, electrostatic capacitance sensor component, object mounting body and object mounting apparatus
#33 | 2005-06-28 ✅ Patent 6,910,440 granted on 2005-06-28Apparatus for plasma processing
#34 | 2005-05-19 ✅ Patent 7,199,046 granted on 2007-04-03Structure comprising tunable anti-reflective coating and method of forming thereof
#35 | 2005-02-01 ✅ Patent 6,848,470 granted on 2005-02-01Parallel divided flow-type fluid supply apparatus, and fluid-switchable pressure-type flow control method and fluid-switchable pressure-type flow control system for the same fluid supply apparatus
#36 | 2005-01-13 ✅ Patent 7,059,363 granted on 2006-06-13Method of supplying divided gas to a chamber from a gas supply apparatus equipped with a flow-rate control system
Also check out Tokyo Electron Ltd.'s (Tokyo, Japan) applicant profile with 5 patent applications submitted.
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