Akio Kojima

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2008-01-17

Top Assignees for applications by Akio Kojima

The entities that hold a legal rights for patent applications filed by inventor Kojima Akio:

RICOH COMPANY, LTD. 3 Tokyo, Japan
Advantest Corp. 1 Tokyo, Japan
Teletech Co., Ltd. 1 Tokyo, Japan

Recent patent applications by Kojima Akio

Akio Kojima from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-01-17

US20080010824A1

Physics

Probe card and method for manufacturing probe card

#2 | 2006-06-13

US10701061

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device

#3 | 2006-02-02

US20060024597A1

Physics

Electrophotographic photoconductor for liquid development, image forming apparatus having the same, and image forming method

#4 | 2006-01-19

US20060011703A1

Electricity

#5 | 2005-10-13

US20050225336A1

Physics

Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive

#6 | 2005-03-01

US9983215

Virtual horseracing system

InventorID:

4093673 ⎘