Sanjay C. Mehta

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

Last publication date:

2008-06-05

Top Assignees for applications by Sanjay C. Mehta

The entities that hold a legal rights for patent applications filed by inventor Mehta Sanjay C.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 8 ARMONK, NY United States
ADVANCED MICRO DEVICES, INC. (AMD) 1 Sunnyvale, CA United States
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, United States

Recent patent applications by Mehta Sanjay C.

Sanjay C. Mehta from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-06-05

US20080132055A1

Electricity

Hardmask for improved reliability of silicon based dielectrics

#2 | 2008-05-22

US20080118717A1

Electricity

HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS

#3 | 2008-03-27

US20080073790A1

Electricity

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

#4 | 2008-01-17

US20080012142A1

Electricity

Structure and method of chemically formed anchored metallic vias

#5 | 2007-10-04

US20070228570A1

Electricity

Reliable BEOL integration process with direct CMP of porous SiCOH dielectric

#6 | 2007-03-29

US20070072412A1

Electricity

PREVENTING DAMAGE TO INTERLEVEL DIELECTRIC

#7 | 2006-08-24

US20060189133A1

Electricity

Reliable BEOL integration process with direct CMP of porous SiCOH dielectric

#8 | 2006-05-04

US20060091559A1

Electricity

Hardmask for reliability of silicon based dielectrics

#9 | 2005-04-07

US20050074959A1

Electricity

Method of fabricating a wire bond pad with Ni/Au metallization

InventorID:

4094907 ⎘