Yanping Li

City:

Mountain View, California

Country:

United States

Published Applications:

Last publication date:

2008-10-16

Top Assignees for applications by Yanping Li

The entities that hold a legal rights for patent applications filed by inventor Li Yanping:

Applied Materials, Inc. 5 Santa Clara, CA United States

Recent patent applications by Li Yanping

Yanping Li from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-10-16

US20080254613A1

Electricity

METHODS FOR FORMING METAL INTERCONNECT STRUCTURE FOR THIN FILM TRANSISTOR APPLICATIONS

#2 | 2008-10-09

US20080245414A1

Electricity

METHODS FOR FORMING A PHOTOVOLTAIC DEVICE WITH LOW CONTACT RESISTANCE

#3 | 2008-06-26

US20080153280A1

Chemistry; metallurgy

REACTIVE SPUTTER DEPOSITION OF A TRANSPARENT CONDUCTIVE FILM

#4 | 2008-06-12

US20080138974A1

Electricity

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

#5 | 2008-04-24

US20080096376A1

Electricity

Transparent zinc oxide electrode having a graded oxygen content

#6 | 2008-01-17

US20080014732A1

Electricity

Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding

#7 | 2006-09-14

US20060205238A1

Electricity

Silicon-containing structure with deep etched features, and method of manufacture

#8 | 2006-09-14

US20060202352A1

Electricity

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

#9 | 2006-07-11

US10210929

Method of plasma etching a deeply recessed feature in a substrate using a plasma source gas modulated etchant system

InventorID:

4097111 ⎘