Round Rock, Texas
United States
9
2013-10-03
The entities that hold a legal rights for patent applications filed by inventor Su Michael:
Michael Su from Round Rock, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
#2 | 2013-10-03STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#3 | 2013-10-03Thermal management of stacked semiconductor chips with electrically non-functional interconnects
#4 | 2013-08-29Semiconductor workpiece with backside metallization and methods of dicing the same
#5 | 2012-03-01Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method
#6 | 2011-02-10Semiconductor devices having stress relief layers and methods for fabricating the same
#7 | 2010-12-02Semiconductor device having a filled trench structure and methods for fabricating the same
#8 | 2010-08-19Semiconductor chip with reinforcement layer and method of making the same
#9 | 2009-12-10Semiconductor chip with reinforcement structure
409846 ⎘