Tainan City
Taiwan
11
2009-12-31
The entities that hold a legal rights for patent applications filed by inventor Yu Chun Hui:
Chun Hui Yu from Tainan City, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
System-in-package and manufacturing method of the same
#2 | 2008-07-03RF module package for releasing stress
#3 | 2008-07-03RF module package
#4 | 2008-06-26Structure of dielectric layers in built-up layers of wafer level package
#5 | 2008-06-19TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME
#6 | 2008-06-12MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#7 | 2008-02-21Method for forming filling paste structure of WL package
#8 | 2008-02-07METHOD FOR SEPARATING PACKAGE OF WLP
#9 | 2007-03-29Method for separating package of WLP
#10 | 2006-07-06Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP
#11 | 2006-07-06FBGA and COB package structure for image sensor
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