Boping Wu

City:

Seattle, Washington

Country:

United States

Published Applications:

Last publication date:

2008-04-03

Top Assignees for applications by Boping Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Boping:

Boping Wu from Seattle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Micro-via structure design for high performance integrated circuits

InventorID:

4149082 ⎘