Milpitas, California
United States
35
2022-02-10
The entities that hold a legal rights for patent applications filed by inventor Carlsson Ingemar:
Ingemar Carlsson from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Resistivity-based adjustment of thresholds for in-situ monitoring
#2 | 2019-05-09Determination of gain for eddy current sensor
#3 | 2019-01-31Inductive monitoring of conductive loops
#4 | 2018-07-19Resistivity-based calibration of in-situ electromagnetic inductive monitoring
#5 | 2018-07-19Resistivity-based adjustment of measurements from in-situ monitoring
#6 | 2018-03-22Endpoint detection with compensation for filtering
#7 | 2017-12-21Inductive monitoring of conductive trench depth
#8 | 2017-06-01Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing
#9 | 2016-06-09Determination of gain for eddy current sensor
#10 | 2015-12-24Inductive monitoring of conductive trench depth
#11 | 2015-08-13Adjusting eddy current measurements
#12 | 2015-04-30Determination of gain for eddy current sensor
#13 | 2015-04-30Determination of gain for eddy current sensor
#14 | 2014-08-07ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING
#15 | 2014-05-08In-situ monitoring system with monitoring of elongated region
#16 | 2014-01-30CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING
#17 | 2014-01-23Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
#18 | 2013-08-29Feedback control using detection of clearance and adjustment for uniform topography
#19 | 2012-11-01EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS
#20 | 2012-11-01EDDY CURRENT MONITORING OF METAL FEATURES
#21 | 2012-11-01High sensitivity eddy current monitoring system
#22 | 2012-03-15Feedback control of polishing using optical detection of clearance
#23 | 2012-03-01Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
#24 | 2011-12-08Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
#25 | 2011-12-01Determining Physical Property of Substrate
#26 | 2011-02-24METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA
#27 | 2010-10-14Determining physical property of substrate
#28 | 2010-05-20Eddy current sensor with enhanced edge resolution
#29 | 2010-05-13ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING
#30 | 2010-05-13Endpoint control of multiple-wafer chemical mechanical polishing
#31 | 2009-02-05Determining physical property of substrate
#32 | 2008-10-02Methods and apparatus for generating a library of spectra
#33 | 2008-10-02High throughput measurement system
#34 | 2008-06-19Determining physical property of substrate
#35 | 2006-08-29Determination of position of sensor measurements during polishing
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