Munich
Germany
39
2019-12-26
The entities that hold a legal rights for patent applications filed by inventor Wahl Uwe:
Uwe Wahl from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for producing a semiconductor arrangement
#2 | 2019-01-17Charge-compensation semiconductor device and a manufacturing method therefor
#3 | 2017-01-05Electronic device and method of manufacturing the same
#4 | 2016-10-13Semiconductor Device Including a Superjunction Structure with Drift Regions and Compensation Structures
#5 | 2016-09-15Super junction semiconductor device having columnar super junction regions extending into a drift layer
#6 | 2016-07-28Super junction semiconductor device with field extension zones
#7 | 2015-06-11Half-bridge circuit with a low-side transistor and a level shifter transistor integrated in a common semiconductor body
#8 | 2015-05-28Super junction semiconductor device having columnar super junction regions
#9 | 2015-05-14Signal transmission arrangement
#10 | 2015-04-30Semiconductor device and integrated apparatus comprising the same
#11 | 2015-02-26Method of manufacturing a super junction semiconductor device with overcompensation zones
#12 | 2015-01-08Semiconductor device with vertical transistor channels and a compensation structure
#13 | 2014-11-13Trench transistor having a doped semiconductor region
#14 | 2014-08-21Super Junction Semiconductor Device with an Edge Area Having a Reverse Blocking Capability
#15 | 2014-08-21Manufacturing a super junction semiconductor device
#16 | 2014-08-21Super junction semiconductor device comprising implanted zones
#17 | 2014-08-21Super junction semiconductor device with overcompensation zones
#18 | 2014-08-21Semiconductor device with a super junction structure having a vertical impurity distribution
#19 | 2014-06-12Semiconductor device and method of manufacture thereof
#20 | 2014-01-02Super junction semiconductor device comprising a cell area and an edge area
#21 | 2013-12-12Semiconductor device and method of manufacture thereof
#22 | 2013-11-21Semiconductor Devices Including Superjunction Structure and Method of Manufacturing
#23 | 2013-09-26Semiconductor arrangement with a power transistor and a high voltage device integrated in a common semiconductor body
#24 | 2013-08-29Lateral trench transistor, as well as a method for its production
#25 | 2012-11-01High voltage resistance coupling structure
#26 | 2012-07-19Semiconductor device and method of manufacture thereof
#27 | 2012-04-05Transformer Arrangement
#28 | 2011-10-06High voltage semiconductor devices and methods of forming the same
#29 | 2011-07-21Signal transmission arrangement
#30 | 2011-06-23Signal transmission arrangement
#31 | 2011-06-09Power semiconductor component with plate capacitor structure and edge termination
#32 | 2011-05-19Power semiconductor component with plate capacitor structure having an edge plate electrically connected to source or drain potential
#33 | 2011-04-28High voltage resistance coupling structure
#34 | 2009-09-10Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component
#35 | 2009-08-06Semiconductor configuration having an integrated coupler and method for manufacturing such a semiconductor configuration
#36 | 2009-01-29Integrated circuit including a semiconductor assembly in thin-SOI technology
#37 | 2008-07-31Lateral semiconductor component with a drift zone having at least one field electrode
#38 | 2007-04-12Lateral SOI component having a reduced on resistance
#39 | 2006-11-23Power semiconductor component with plate capacitor structure
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