Erik W. Jensen

City:

Fredensborg

Country:

Denmark

Published Applications:

Last publication date:

2008-04-17

Top Assignees for applications by Erik W. Jensen

The entities that hold a legal rights for patent applications filed by inventor Jensen Erik W.:

Erik W. Jensen from Fredensborg, DK has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of fabricating a via attached to a bond pad utilizing a tapered interconnect

Via attached to a bond pad utilizing a tapered interconnect

Interconnect

InventorID:

4157249 ⎘