Dresden
Germany
21
2026-03-19
The entities that hold a legal rights for patent applications filed by inventor Binder Boris:
Boris Binder from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF MANUFACTURING A RADIO FREQUENCY BIPOLAR TRANSISTOR AND RADIO FREQUENCY BIPOLAR TRANSISTOR
#2 | 2023-04-20HETEROEPITAXIAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A HETEROEPITAXIAL SEMICONDUCTOR DEVICE
#3 | 2021-06-03Method for manufacturing a sensor device with a buried deep trench structure and sensor device
#4 | 2021-01-14Producing a buried cavity in a semiconductor substrate
#5 | 2017-03-30Sensor structures, systems and methods with improved integration and optimized footprint
#6 | 2015-12-31Micromechanical system and method for manufacturing a micromechanical system
#7 | 2015-12-31Method for manufacturing a micromechanical system
#8 | 2015-11-05Wafer, a method for processing a wafer, and a method for processing a carrier
#9 | 2015-07-30Sensor structures, systems and methods with improved integration and optimized footprint
#10 | 2015-07-30Sensor structures, systems and methods with improved integration and optimized footprint
#11 | 2015-07-23METHOD OF FABRICATING ISOLATING SEMICONDUCTOR STRUCTURES
#12 | 2014-08-14Semiconductor structure with lamella defined by singulation trench
#13 | 2013-12-19Method of providing a semiconductor structure with forming a sacrificial structure
#14 | 2013-12-12Semiconductor manufacturing and semiconductor device with semiconductor structure
#15 | 2013-05-30Method of fabricating isolating semiconductor structures using a layout of trenches and openings
#16 | 2013-01-03Acceleration sensor
#17 | 2012-06-28Method of providing a semiconductor structure with forming a sacrificial structure
#18 | 2012-03-22Semiconductor manufacturing and semiconductor device with semiconductor structure
#19 | 2011-03-24Semiconductor structure with lamella defined by singulation trench
#20 | 2010-07-29Acceleration sensor
#21 | 2010-03-11Semiconductor device including a pressure sensor
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