Inventor profile of:

Boris Binder

City:

Dresden

Country:

Germany

Published Applications:

21

Last publication date:

2026-03-19

Top Assignees for applications by Boris Binder

The entities that hold a legal rights for patent applications filed by inventor Binder Boris:

Recent patent applications by Binder Boris

Boris Binder from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-19
US20260082605A1
Electricity

METHOD OF MANUFACTURING A RADIO FREQUENCY BIPOLAR TRANSISTOR AND RADIO FREQUENCY BIPOLAR TRANSISTOR

#2 | 2023-04-20
US20230123410A1
Electricity

HETEROEPITAXIAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A HETEROEPITAXIAL SEMICONDUCTOR DEVICE

#3 | 2021-06-03
US20210167117A1
Electricity

Method for manufacturing a sensor device with a buried deep trench structure and sensor device

#4 | 2021-01-14
US20210013087A1
Electricity

Producing a buried cavity in a semiconductor substrate

#5 | 2017-03-30
US20170089790A1
Physics

Sensor structures, systems and methods with improved integration and optimized footprint

#6 | 2015-12-31
US20150375999A1
Performing operations; transporting

Micromechanical system and method for manufacturing a micromechanical system

#7 | 2015-12-31
US20150375998A1
Performing operations; transporting

Method for manufacturing a micromechanical system

#8 | 2015-11-05
US20150318166A1
Electricity

Wafer, a method for processing a wafer, and a method for processing a carrier

#9 | 2015-07-30
US20150210535A1
Performing operations; transporting

Sensor structures, systems and methods with improved integration and optimized footprint

#10 | 2015-07-30
US20150210533A1
Performing operations; transporting

Sensor structures, systems and methods with improved integration and optimized footprint

#11 | 2015-07-23
US20150203350A1
Performing operations; transporting

METHOD OF FABRICATING ISOLATING SEMICONDUCTOR STRUCTURES

#12 | 2014-08-14
US20140227818A1
Performing operations; transporting

Semiconductor structure with lamella defined by singulation trench

#13 | 2013-12-19
US20130334624A1
Performing operations; transporting

Method of providing a semiconductor structure with forming a sacrificial structure

#14 | 2013-12-12
US20130328143A1
Performing operations; transporting

Semiconductor manufacturing and semiconductor device with semiconductor structure

#15 | 2013-05-30
US20130134530A1
Performing operations; transporting

Method of fabricating isolating semiconductor structures using a layout of trenches and openings

#16 | 2013-01-03
US20130001712A1
Physics

Acceleration sensor

#17 | 2012-06-28
US20120161254A1
Performing operations; transporting

Method of providing a semiconductor structure with forming a sacrificial structure

#18 | 2012-03-22
US20120068277A1
Performing operations; transporting

Semiconductor manufacturing and semiconductor device with semiconductor structure

#19 | 2011-03-24
US20110068420A1
Performing operations; transporting

Semiconductor structure with lamella defined by singulation trench

#20 | 2010-07-29
US20100186511A1
Physics

Acceleration sensor

#21 | 2010-03-11
US20100058876A1
Physics

Semiconductor device including a pressure sensor

InventorID:

4159 ⎘