Avi Dayan

City:

Jerusalem

Country:

Israel

Published Applications:

Last publication date:

2008-05-01

Top Assignees for applications by Avi Dayan

The entities that hold a legal rights for patent applications filed by inventor Dayan Avi:

Avi Dayan from Jerusalem, IL has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer level packaging to lidded chips

Wafer level chip packaging

InventorID:

4164741 ⎘