Hungary
11
2008-05-01
11
2010-10-05
These are the the leading inventors for applications assigned to Tessera Technologies Hungary Kft.:
Tessera Technologies Hungary Kft. based in , HU has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
#2 | 2008-01-24 ✅ Patent 7,479,398 granted on 2009-01-20Methods and apparatus for packaging integrated circuit devices
#3 | 2008-01-17 ✅ Patent 7,642,629 granted on 2010-01-05Methods and apparatus for packaging integrated circuit devices
#4 | 2007-06-21 ✅ Patent 7,495,341 granted on 2009-02-24Methods and apparatus for packaging integrated circuit devices
#5 | 2007-02-22 ✅ Patent 7,781,240 granted on 2010-08-24Integrated circuit device
#6 | 2007-01-18 ✅ Patent 7,408,249 granted on 2008-08-05Packaged integrated circuits and methods of producing thereof
#7 | 2007-01-02 ✅ Patent 7,157,742 granted on 2007-01-02Integrated circuit device
#8 | 2006-12-05 ✅ Patent 7,144,745 granted on 2006-12-05Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced
#9 | 2006-04-25 ✅ Patent 7,033,664 granted on 2006-04-25Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
#10 | 2005-09-22 ✅ Patent 7,265,440 granted on 2007-09-04Methods and apparatus for packaging integrated circuit devices
#11 | 2005-05-19 ✅ Patent 7,192,796 granted on 2007-03-20Methods and apparatus for packaging integrated circuit devices
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