Chandler, Arizona
United States
15
2011-03-03
The entities that hold a legal rights for patent applications filed by inventor Lehman Stephen E.:
Stephen E. Lehman from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Solder joint reliability in microelectronic packaging
#2 | 2008-05-22CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME
#3 | 2008-05-22Solder joint reliability in microelectronic packaging
#4 | 2007-12-13Solder flux composition
#5 | 2007-11-15Thermoset polyimides for microelectronic applications
#6 | 2007-08-16Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
#7 | 2007-07-05Wafer-level processing of chip-packaging compositions including bis-maleimides
#8 | 2007-07-05Smart curing with a catalyst-functionalized surface
#9 | 2007-07-05Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same
#10 | 2007-04-26Chip-packaging composition of resin and cycloaliphatic amine hardener
#11 | 2007-02-08Application of autonomic self healing composites to integrated circuit packaging
#12 | 2006-11-30Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging
#13 | 2006-05-04Cyclic olefin polymers and catalyst for semiconductor applications
#14 | 2006-03-30Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
#15 | 2005-06-23Linear functional copolymers of ethylene with precise and minimum run length distributions and method of making thereof
4176778 ⎘