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Inventor profile of:

Tim A. Renfro

City:

Mesa, Arizona

Country:

United States

Published Applications:

9

Last publication date:

2008-07-03

Top Assignees for applications by Tim A. Renfro

The entities that hold a legal rights for patent applications filed by inventor Renfro Tim A.:

  • INTEL CORPORATION 5 Santa Clara, CA United States

Recent patent applications by Renfro Tim A.

Tim A. Renfro from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-07-03
US20080156457A1
Performing operations; transporting

Thermally coupling an integrated heat spreader to a heat sink base

#2 | 2008-05-22
US20080119081A1
Electricity

SOCKET WARPAGE REDUCTION APPARATUS

#3 | 2008-04-01
US10758055
-

Method for reducing socket warpage

#4 | 2006-02-23
US20060040523A1
Electricity

Integrated socket and cable connector

#5 | 2006-02-09
US20060027635A1
Performing operations; transporting

Thermally coupling an integrated heat spreader to a heat sink base

#6 | 2005-11-29
US10609231
-

Integrated socket and cable connector

#7 | 2005-11-17
US20050255723A1
Electricity

Attaching integrated circuits to printed circuit boards

#8 | 2005-11-03
US20050243521A1
Electricity

Aligning socket load plates to integral heat spreaders

#9 | 2005-07-28
US20050164505A1
Electricity

Land grid array membrane

InventorID:

4178951 ⎘

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