Tom Hu

City:

Gilbert, Arizona

Country:

United States

Published Applications:

Last publication date:

2008-06-26

Top Assignees for applications by Tom Hu

The entities that hold a legal rights for patent applications filed by inventor Hu Tom:

Tom Hu from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

Saw and etch singulation method for a chip package

InventorID:

4201801 ⎘