Phoenix, Arizona
United States
14
2008-06-26
The entities that hold a legal rights for patent applications filed by inventor Towle Steven:
Steven Towle from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Thinned die integrated circuit package
#2 | 2007-02-27Low cost microelectronic circuit package
#3 | 2006-07-04Method for packaging a microelectronic device using on-die bond pad expansion
#4 | 2006-05-02Electrooptic assembly
#5 | 2006-04-13Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#6 | 2006-03-30Manufacturable connectorization process for optical chip-to-chip interconnects
#7 | 2006-03-30On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
#8 | 2005-07-28Package substrate pattern to accommodate optical waveguide
#9 | 2005-06-16Underfill integration for optical packages
#10 | 2005-06-09Thinned die integrated circuit package
#11 | 2005-05-17Microelectronic device having signal distribution functionality on an interfacial layer thereof
#12 | 2005-05-03High performance, low cost microelectronic circuit package with interposer
#13 | 2005-03-10Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#14 | 2005-01-04Forming defect prevention trenches in dicing streets
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