Paul Smith

City:

Campbell, California

Country:

United States

Published Applications:

Last publication date:

2008-08-07

Top Assignees for applications by Paul Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Paul:

Paul Smith from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and apparatus for measuring a thickness of a layer of a wafer

Apparatus and method of dynamically measuring thickness of a layer of a substrate

Method and apparatus for dynamically measuring the thickness of an object

InventorID:

4226710 ⎘