Michael Wayne Harper

City:

Round Rock, Texas

Country:

United States

Published Applications:

Last publication date:

2008-08-14

Top Assignees for applications by Michael Wayne Harper

The entities that hold a legal rights for patent applications filed by inventor Harper Michael Wayne:

IBM Corporation 2 Austin, TX United States
INTERNATIONAL BUSINESS MACHINES CORPORATION 2 ARMONK, NY United States

Recent patent applications by Harper Michael Wayne

Michael Wayne Harper from Round Rock, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-08-14

US20080191781A1

Physics

Virtual electronic fuse apparatus and methodology

#2 | 2008-08-14

US20080191780A1

Physics

Electronic fuse apparatus and methodology including addressable virtual electronic fuses

InventorID:

4230722 ⎘