Kein Fee Liew

City:

Perak

Country:

Malaysia

Published Applications:

Last publication date:

2015-03-12

Top Assignees for applications by Kein Fee Liew

The entities that hold a legal rights for patent applications filed by inventor Liew Kein Fee:

Kein Fee Liew from Perak, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY

Backside mold process for ultra thin substrate and package on package assembly

Backside mold process for ultra thin substrate and package on package assembly

InventorID:

424924 ⎘