Villach
Austria
44
2026-06-11
The entities that hold a legal rights for patent applications filed by inventor Brockmeier Andre:
Andre Brockmeier from Villach, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS FOR FORMING AN OPTICAL PACKAGE
#2 | 2026-06-04GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
#3 | 2026-05-07METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL SYSTEM MIRROR DEVICE, MANUFACTURING APPARATUS, SET OF MIRROR DEVICES AND WAFER
#4 | 2026-04-16IMAGE PROJECTION SYSTEM
#5 | 2025-12-11MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
#6 | 2025-03-20SANDWICH STRUCTURES FOR MICROELECTROMECHANICAL SYSTEM MICRO-MIRRORS
#7 | 2023-09-143D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FOOTPRINT
#8 | 2022-09-15METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE ATTACHED TO A WIDE BAND-GAP SEMICONDUCTOR WAFER
#9 | 2022-03-17Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
#10 | 2022-02-03MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
#11 | 2021-11-25Method for processing a layer structure and microelectromechanical component
#12 | 2021-10-07Method with stealth dicing process for fabricating MEMS semiconductor chips
#13 | 2021-08-19Method with mechanical dicing process for producing MEMS components
#14 | 2021-06-03Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor device
#15 | 2020-12-10GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
#16 | 2020-09-03Method for processing a layer structure and microelectromechanical component
#17 | 2020-06-25Method for processing a monocrystalline substrate and micromechanical structure
#18 | 2020-06-18Semiconductor device and method of manufacturing a semiconductor device
#19 | 2020-02-27Carrier, laminate and method of manufacturing semiconductor devices
#20 | 2019-07-11Energy filter for processing a power semiconductor device
#21 | 2019-03-07Method for processing a layer structure and microelectromechanical component
#22 | 2019-01-24Method of Manufacturing a Plurality of Glass Members, a Method of Manufacturing an Optical Member, and Array of Glass Members in a Glass Substrate
#23 | 2018-09-20Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces
#24 | 2018-08-09Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure
#25 | 2018-03-29Method for processing a monocrystalline substrate and micromechanical structure
#26 | 2018-03-08Semiconductor package devices and method for forming semiconductor package devices
#27 | 2018-03-01Semiconductor device with plated lead frame
#28 | 2017-12-14Superjunction structure in a power semiconductor device
#29 | 2017-12-07Energy filter for processing a power semiconductor device
#30 | 2017-07-13MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD ARTICLE
#31 | 2017-05-25Method of manufacturing a semiconductor device having a vertical edge termination structure
#32 | 2017-02-02Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrate
#33 | 2016-11-17DEVICES WITH THINNED WAFER
#34 | 2016-06-30Capacitive microphone with insulated conductive plate
#35 | 2016-03-24Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion
#36 | 2015-10-01Semiconductor device including a vertical edge termination structure and method of manufacturing
#37 | 2015-09-03Devices with thinned wafer
#38 | 2015-08-27Semiconductor device with plated lead frame, and method for manufacturing thereof
#39 | 2015-08-13Method for manufacturing a plurality of microphone structures, microphone and mobile device
#40 | 2015-06-25MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD ARTICLE
#41 | 2014-05-01Glass carrier with embedded semiconductor device and metal layers on the top surface
#42 | 2014-01-23Chip package and a method for manufacturing a chip package
#43 | 2013-09-12Method of manufacturing semiconductor device with glass pieces
#44 | 2013-09-12Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices
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