Singapore
Singapore
26
2018-04-19
The entities that hold a legal rights for patent applications filed by inventor Koo Jun Mo:
Jun Mo Koo from Singapore, SG has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of forming interposer with opening to contain semiconductor die
#2 | 2017-04-06Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#3 | 2016-07-07Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#4 | 2014-09-18Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
#5 | 2014-09-11Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
#6 | 2014-03-20Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#7 | 2014-03-20Semiconductor device with protective layer over exposed surfaces of semiconductor die
#8 | 2014-02-27Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
#9 | 2013-11-14Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
#10 | 2013-08-22Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
#11 | 2013-01-03Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#12 | 2012-10-18Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#13 | 2012-10-04Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#14 | 2012-05-03Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
#15 | 2012-03-29Semiconductor device and method of bonding different size semiconductor die at the wafer level
#16 | 2012-03-29Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer
#17 | 2012-03-15Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP
#18 | 2012-03-01Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#19 | 2012-03-01Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die
#20 | 2012-01-19Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die
#21 | 2011-12-29Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect
#22 | 2011-12-29Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#23 | 2011-12-08Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#24 | 2011-12-08Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#25 | 2011-11-17Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#26 | 2011-03-24Semiconductor device and method of forming interposer with opening to contain semiconductor die
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