Inventor profile of:

Thomas P. Glenn

City:

Gilbert, Arizona

Country:

United States

Published Applications:

22

Last publication date:

2015-12-29

Top Assignees for applications by Thomas P. Glenn

The entities that hold a legal rights for patent applications filed by inventor Glenn Thomas P.:

Recent patent applications by Glenn Thomas P.

Thomas P. Glenn from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-12-29
US14592648
Electricity

Integrated circuit package and method of making the same

#2 | 2015-02-24
US14142457
Electricity

Integrated circuit package and method of making the same

#3 | 2014-10-07
US13662702
-

Integrated circuit package and method of making the same

#4 | 2012-11-27
US13009690
-

Integrated circuit package and method of making the same

#5 | 2009-10-27
US11315994
-

Optical module having cavity substrate

#6 | 2009-07-14
US11970712
-

Integrated circuit package and method of making the same

#7 | 2008-12-18
US20080308717A1
Electricity

Camera module with window mechanical attachment

#8 | 2008-02-19
US11503752
-

Method of making an integrated circuit package

#9 | 2006-09-26
US11299859
-

Method of making an integrated circuit package

#10 | 2006-07-04
US10626150
-

Plastic integrated circuit package and method and leadframe for making the package

#11 | 2006-06-13
US9764196
-

Optical module with lens integral holder fabrication method

#12 | 2006-04-18
US11021340
-

Plastic integrated circuit package and method and leadframe for making the package

#13 | 2006-02-28
US10847742
-

Method of making an integrated circuit package

#14 | 2006-02-09
US20060027740A1
Electricity

Snap lid camera module

#15 | 2005-11-22
US10688138
-

Mounting for a package containing a chip

#16 | 2005-11-08
US10150400
-

Method of making near chip size integrated circuit package

#17 | 2005-09-20
US10286269
-

Method of fabricating and using an image sensor package

#18 | 2005-09-13
US9803084
-

Wafer having alignment marks extending from a first to a second surface of the wafer

#19 | 2005-05-17
US10688710
-

Method of making an integrated circuit package

#20 | 2005-04-05
US9751537
-

Tool and method for forming an integrated optical circuit

#21 | 2005-03-22
US9803083
-

Back-side wafer singulation method

#22 | 2005-02-01
US9713848
-

Flip chip on glass sensor package

InventorID:

4311027 ⎘