Phoenix, Arizona
United States
6
2007-10-04
The entities that hold a legal rights for patent applications filed by inventor Frutschy Kristopher J.:
Kristopher J. Frutschy from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
#2 | 2007-03-01Radiant energy heating for die attach
#3 | 2006-03-23Radiant energy heating for die attach
#4 | 2006-03-02Integrated package inductor for integrated circuit devices
#5 | 2005-06-30Induction-based heating for chip attach
#6 | 2005-02-03Socket for a microelectronic component having reduced electrical resistance and inductance
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