Bad Abbach
Germany
66
2021-07-08
The entities that hold a legal rights for patent applications filed by inventor Mengel Manfred:
Manfred Mengel from Bad Abbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermoelectric devices and methods for forming thermoelectric devices
#2 | 2021-06-03CHIP ARRANGEMENTS
#3 | 2021-01-21Thermal interface material having defined thermal, mechanical and electric properties
#4 | 2019-05-02Thermoelectric Devices and Methods for Forming Thermoelectric Devices
#5 | 2018-02-01Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer
#6 | 2018-02-01Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer box
#7 | 2017-11-09Chip arrangements
#8 | 2017-04-27Thermal interface material having defined thermal, mechanical and electric properties
#9 | 2017-01-05Method for manufacturing a chip arrangement including a ceramic layer
#10 | 2017-01-05Micromechanical semiconductor sensing device
#11 | 2016-12-22Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#12 | 2016-12-22Laminar Structure, a Semiconductor Device and Methods for Forming Semiconductor Devices
#13 | 2016-08-18Method for Electrophoretically Depositing a Film on an Electronic Assembly
#14 | 2015-10-01SEMICONDUCTOR DEVICE
#15 | 2015-08-06Micromechanical semiconductor sensing device
#16 | 2015-05-28Electronic component with electronic chip between redistribution structure and mounting structure
#17 | 2015-04-23Electronic component
#18 | 2015-04-16Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#19 | 2014-07-17Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
#20 | 2014-07-17CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
#21 | 2014-03-20Method for electrophoretically depositing a film on an electronic assembly
#22 | 2014-01-02Method for manufacturing a chip package
#23 | 2013-12-12Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#24 | 2013-10-24Semiconductor device including a polymer disposed on a carrier
#25 | 2013-10-24Chip package and method of forming the same
#26 | 2013-06-20Micromechanical semiconductor sensing device
#27 | 2013-05-30Chip-package and a method for forming a chip-package
#28 | 2013-05-09Device including two power semiconductor chips and manufacturing thereof
#29 | 2013-03-14Protection for circuit boards
#30 | 2013-01-24Electronic component
#31 | 2013-01-03Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
#32 | 2012-12-27Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
#33 | 2012-12-13Solder alloys and arrangements
#34 | 2012-10-25Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
#35 | 2012-03-29Method and system for minimizing carrier stress of a semiconductor device
#36 | 2012-03-29Method and system for improving reliability of a semiconductor device
#37 | 2012-03-22Device and method for manufacturing a device
#38 | 2011-02-10Method of manufacturing a semiconductor device
#39 | 2011-01-06Method of manufacturing a semiconductor device
#40 | 2010-09-30Method of fabricating a semiconductor device
#41 | 2010-08-19Method of manufacturing semiconductor devices
#42 | 2010-08-12Method of manufacturing a semiconductor device
#43 | 2010-06-17Semiconductor device
#44 | 2010-05-27Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions
#45 | 2010-04-29Semiconductor device
#46 | 2010-04-01Coating composition and a method of coating
#47 | 2010-02-25Semiconductor device
#48 | 2010-02-04Semiconductor device
#49 | 2009-09-24SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
#50 | 2009-09-24Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#51 | 2009-07-30Electronic device and method of manufacturing same
#52 | 2009-03-26INTEGRATED CIRCUIT DEVICE
#53 | 2009-03-19Integrated circuit device having a gas-phase deposited insulation layer
#54 | 2009-03-19Semiconductor device
#55 | 2009-03-19Semiconductor device
#56 | 2008-11-13Protection for circuit boards
#57 | 2008-10-16Curing layers of a semiconductor product using electromagnetic fields
#58 | 2008-10-02Integrated circuit arrangement
#59 | 2008-08-14Protection For Circuit Boards
#60 | 2008-07-31Method for producing a device and device
#61 | 2008-07-24Semiconductor device with parylene coating
#62 | 2008-07-10Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip
#63 | 2008-03-20Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same
#64 | 2007-09-13Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
#65 | 2007-04-19Encapsulation of a chip module
#66 | 2005-06-30Flexible rewiring plate for semiconductor components, and process for producing it
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